Trade shows and other events

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JEC—Largest networking forum for composites is a great success

Evonik once again took part in the European JEC trade show in Paris, the largest and most important networking forum for composite materials. In addition to the PMI foam ROHACELL^®, the company presented among others PEEK powders that are suited as a matrix for thermoplastic composites and are already used by customers. VESTAMID^® HTplus, a PA10T, which is primarily intended for aerospace and automotive applications, was a new addition to the exhibited products.

At the trade show, the experts of the ROHACELL^® Product Line introduced the new ROHACELL^® HP, which combines the advantages of the highly heat-resistant XT grade with the fine cell structure of ROHACELL^® RIMA. There was much interest in HP, and the company will now follow up by sending out product samples to provide customers with tangible evidence of the processing benefits of the new material. The new product will contribute to further optimizations in manufacturing, for example, by improving sandwich constructions in aircraft manufacturing.

Moreover, Evonik showed how a manufacturer of engine cowlings has made a successful switch from a honeycomb structure to ROHACELL^®, which was accomplished in partnership with this manufacturer. ROHACELL^® is also in demand for lightweight, transportable bridge elements, which are used temporarily, for example, in disaster areas to assist the work of firefighters and the Technisches Hilfswerk (disaster relief agency in Germany). After the less-than-desirable results of the 2009 trade show, the ROHACELL^® team was pleased to report over 200 new sales leads.

MedTec Europe 2010, Stuttgart

At this year's MedTec Europe in Stuttgart between March 23 to 25, 2010, visitors of our booth were most interested in the VESTAKEEP^® products for long-term body contact. Our experts have taken a lot of tasks to follow up for this subject as well as for the other presented products.

Semicon 2010, Seoul

For the first time and with great success, Evonik presented its VESTAKEEP^® products at the microelectronics fair Semicon in Seoul, Korea, from February 3 to 5, 2010. In 2011, Evonik will join in Semicon again!

FAKUMA 2009, Friedrichshafen

From October 13 to 17, 2009, our very well frequented booth in Hall 4 addressed especially the subject energy efficiency. In addition to the well-known performance polyamides we focused on the biobased polyamides VESTAMID^® Terra that are new in our product range, the temperature stable polyphthalamide resins VESTAMID^® HTplus, and of course, the VESTAKEEP^® compounds. One third of all visitors at our booth concerned its questions to this high-performance plastic, scheduled following meetings, or was asking for samples.

Offshore Europe 2009, Aberdeen

For the first time Evonik joined the Offshore Europe in Aberdeen, Great Britain, from September 8 to 11, 2009. We presented our materials for the oil and gas industry at the shared Booth No 1360 of NOF Energy.

NPE 2009, Chicago

In spite of this difficult economy, you met us at our Booth No 5062 at NPE from June 22 to 26, 2009 in Chicago, where we highlighted among others, our VESTAKEEP® PEEK materials for medical technology. Many thanks for your interest in our products.

Techtextil 2009, Frankfurt

At Techtextil in Frankfurt between June 16 and 18, 2009, Evonik presented, in addition to the well proven P84® fibers and VESTAMID® D (polyamide 612 for production of filaments), three new products: VESTAMID® Terra, polyamide molding compounds based on renewable raw materials; VESTAMID® HTplus, polyphthalamide molding compounds; and VESTAKEEP® products. All the three polymers are used to manufacture filaments, which in the case of the polyphthalamide compounds is a world first.